The Datacard Central Issuance Platform includes a comprehensive range of technologies to choose from, depending upon your volumes, personalization requirements, card carrier requirements, and growth objectives. Integrate a combination of these technologies to meet your program needs.
DX3100 Key System Specifications
Rated Speed
Operating System
- Microsoft Windows Embedded Standard 7 OS
Template Management
Template Management
- PCL (black & white), Postscript (color), PDF
Electrical Requirements
- Card modules: 230V, 50/60Hz, 15 Amps
- Form modules: 230V, 50/60Hz, 30 Amps
- Inserter modules: 230V, 50/60Hz, 30 Amps
Operating Requirements
- Room temperature: 65° to 80° F (18° to 27° C)
- Humidity: 35% to 85% (non-condensing)
- Recommend service area around system be at least 36” (76.2 cm) to help provide adequate airflow
- See module data sheets for specific information
Storage Requirements
- Room temperature: 50° to 130° F (10° to 54° C)
- Humidity: 0% to 85% (non-condensing)
Agency Approvals
- FCC, UL, cUL, CE and RoHS Compliant
Card Types Supported
- ISO/IEC 7810 ID-1 Size; 30 mil (±10%)
Card Materials Supported
- All card materials can be processed, including PVC, composite, polycarbonate, ABS, PET and PETG. Limitations may exist for each card delivery technology
Paper Types Supported
- 24-28 lb. bond (90-105 gsm)
- Refer to Datacard Card Delivery Paper/Envelope Guidelines for additional information